Dell will be the first technology company to ship its servers in compostable mushroom-based foam. Packaging creator Ecovative Design produces the foam by loading organic waste into a mold and inoculating it with mushroom spores. The material decomposes about a month after it’s buried.
In a blog post Tuesday, Dell procurement director Oliver Campbell announced the start of the pilot program, noting that it’s not the company’s first green packaging initiative: Dell already uses bamboo to cushion many of its smaller products. The mushroom foam however, which takes about 5-10 days to grow, is sturdier and better suited for heavier applications.
Ecovative also plans to work with Ford on developing mushroom foam car parts such as fillers for doors and dashboards.